Electroless plating is the main process of non-metal plating. After the activation treatment, the non-metallic surface has been distributed with a catalytic active center. These active centers act as crystal nuclei for the electroless plating, from which the electroless plating grows into a continuous plating. When the initial plating is formed, the electroless plating has an autocatalytic effect that allows electroless plating to continue.
The principle behind electroless plating is still the redox reaction. The electroless plating process is completed by supplying and exchanging electrons by ions participating in the reaction. Therefore, the electroless plating solution needs to have a reducing agent capable of supplying electrons, and the metal ion to be plated is of course an oxidizing agent. In order to control the plating speed, a complexing agent for stabilizing metal ions and a pH adjusting agent (pH buffering agent) for providing an optimum reducing effect are also required.
The most widely used in non-metal plating is electroless copper plating and electroless nickel plating.
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Label: Electroless plating is the main process of non-metal plating
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