During the "Twelfth Five-Year Plan" period, China's mold industry will further adjust its structure, open up the market, work hard and improve its level, so that the Chinese mold industry will take a new step as a whole, and this is not just a matter of the mold industry. ". The development of the mold industry and other industries can be described by the use of lips and teeth, so the overall improvement of the mold industry is closely related to the development of related industries.
At present, China's mold products are mainly in the middle and low-end, the technical content is low, and most of the high-end molds rely on imports. One of the reasons is that the core technology is missing in the relevant industries. For example, in the field of IC packaging molds, due to the overall level of the domestic IC industry and the reasons for foreign technology blockade, the IC packaging mold industry is difficult to develop at a high starting point. Therefore, while the IT industry and the automobile industry are driving the growth of demand for mold products, it is indispensable to enhance China's overall strength in the IT industry and the automobile industry.
1, semiconductor packaging molds go to automation
The requirements for molds in the semiconductor packaging mold industry are as follows: First, the requirements for finishing molds, the current electronic products are continuously integrated and miniaturized, the products tend to be high-end, the size is getting smaller and smaller, and the package is getting thinner and thinner. The higher the quality, the higher the precision of the mold.
The plastic mold process is one of the most important process methods in the post-process production of semiconductor devices. It generally uses single-cylinder packaging technology, and its package includes DIP, SOP, QFP, SOT, SOD, TR discrete devices and chip tantalum capacitors and inductors. , bridge circuit and other products.
Packaging technology is constantly evolving. The chip size is reduced, the ratio of chip area to package area is closer to 1, the number of I/Os is increased, and the pitch of pins is reduced. The development of packaging technology is inseparable from advanced electronic tooling equipment, multi-injection mold packaging (MGP), automatic die-cutting system, automatic packaging system and other high-tech new products to meet this demand, Sanjia also launched these product.
Multi-injection head package (MGP) is an extension of single-cylinder mold technology and is the mainstream product of today's packaging molds. The utility model adopts a multi-barrel and multi-injection head package form, and has the advantages that the flow channel can be balanced, the close-in filling is realized, the resin utilization rate is high, the packaging process is stable, and the product packaging quality is good. It is suitable for SSOP, TSSOP, LQFP and other multi-row, small pitch, high-density integrated circuits and SOT, SOD and other micro-semiconductor device package.
The automatic die cutting system is an automated device for forming integrated circuits and semiconductor devices. High-speed, multi-functional, and versatile is the development direction of the system, which can meet the molding of various lead frame carriers.
In the future, the development direction of semiconductor packaging molds is to develop packaging molds with higher precision and higher speed - automatic packaging molds. The automatic plastic sealing system is a high-precision, high-automatic equipment for the post-process packaging of integrated circuits. A plurality of plastic sealing working units are arranged in the system, and a modular MGP mode is installed in each unit, and a plurality of units are packaged in the order of preparation, and the whole machine is assembled, loaded, packaged, unloaded, cleaned, glued, and collected. In one. The technology has developed rapidly in foreign countries, and technologies such as film covering and packaging, and plastic packaging have appeared, which can meet the packaging of various high-density and high-lead products.
With the rapid development of microelectronics technology, the application technology of semiconductor post-sealing molding equipment has been continuously improved, and automation has become an inevitable trend. As the first listed company in the mold industry in China, Sanjia will focus on the world's advanced technology and develop the localization process of electronic molds.
2, the connector has high requirements for the mold manufacturing industry
As a port for transmitting signals, the connector has been widely used in various industries such as mobile phones, computers, program-controlled switching, and home appliances. At present, foreign manufacturers occupy the high-end connector market, and domestic manufacturers are mainly low-end, which is partly affected by the level of the connector mold industry. Because the connector mold involves injection molding, terminal stamping, electroplating, etc., Guosheng mainly makes terminal stamping dies, including mobile phone SIM card terminal molds, computer CPU socket STOCK terminal molds, and electrical terminal molds.
In terms of connector terminal molds, domestic manufacturers are mainly low-end, while Guosheng is mainly oriented to high-end areas. Guosheng is currently supporting international connector manufacturers such as Amp AMP and Molex.
The connector has high requirements for the mold manufacturing industry: First, it requires a high level of mold design. Due to the different shapes of the terminals, the connectors have different structures. How to carry out reasonable design is very important. If the structure is unreasonable, the product will be unqualified. . The second is high-precision equipment. The connector terminals require high precision of processing equipment. The accuracy of foreign equipment can reach ±0.002mm, while the average domestic equipment can only reach ±0.01mm. The third is a good processing basic process. A good connector mold requires a perfect combination of design, equipment and process. At the same time, this equipment has higher requirements for matching and high technical barriers. Guosheng uses advanced CNC surface grinding, automatic optical curve grinding, slow wire cutting, machining center and other equipment combinations for production.
Future connector terminal mold requirements are getting higher and higher, which is due to the trend of connector interface miniaturization and high data transmission rate. Therefore, the requirements for mold equipment, materials, quality, etc. are higher, and the punching speed of the punch used in the mold has reached 500 rpm/3000 rpm, which puts higher requirements on the mold enterprises.
Luo Baihui pointed out that China's IT mold enterprises must continuously invest in equipment, and by investing in the most advanced equipment, they can introduce the highest level of technology and technology, and then carry out research and innovation. At present, the wire cutting and 4-axis processing equipment required for connector molds are already manufactured by domestic manufacturers. Although there are still gaps in accuracy and stability, this is a good start. In addition, the mold enterprises must carry out talent training, and constantly improve the technical level of the mold with the method of “going out, please come inâ€.
In addition, the development of small household appliances market, agricultural machinery, food machinery, construction hardware industry will also drive the rapid development of household air conditioning heat sink molds, motor molds, electron gun molds, sheet metal mold industry, and the world's advanced level.
3. Equipment and standardization development will be higher
Although China's mold industry has made great progress and made great progress, in the upstream and downstream supporting links of the mold industry, most of the processing equipment relies on imports, and the machine tool is a weak link. According to Luo Baihui, in 2004, the machine tools in imported processing equipment were about 6 billion US dollars, and most of them used in the mold industry, which also reflected that the domestic industry still needs to refuel in this field. Qin Hao, deputy secretary-general of China Die & Mould Industry Association, believes that domestic manufacturers should pay attention to the equipment manufacturing industry to pay attention to the needs of the mold industry. At present, domestic equipment manufacturers such as Shenyang Machine Tool Group Co., Ltd. have realized the “value-added†potential of mold machine tools, focusing on machining centers. Development and production of CNC machine tools and other equipment. The development of machine tools in the direction of high speed, precision, high performance specialization, systemization, and compounding has also brought new problems to domestic manufacturers.
In the field of mold standard parts, the standard parts of molds that have been produced in China are mainly mold bases, guides, punches, etc., and oil-containing guide plates and wedges for automobile molds. According to Luo Baihui, the coverage of China's mold standard parts in molds is only 40%, and in Europe and the United States, it has reached 70%. Luo Baihui pointed out that standardization has become a new trend in the development of the mold industry. The mold industry should expand the variety of mold standard parts, improve its precision, increase production concentration, and achieve large-scale production.
At present, China's mold products are mainly in the middle and low-end, the technical content is low, and most of the high-end molds rely on imports. One of the reasons is that the core technology is missing in the relevant industries. For example, in the field of IC packaging molds, due to the overall level of the domestic IC industry and the reasons for foreign technology blockade, the IC packaging mold industry is difficult to develop at a high starting point. Therefore, while the IT industry and the automobile industry are driving the growth of demand for mold products, it is indispensable to enhance China's overall strength in the IT industry and the automobile industry.
1, semiconductor packaging molds go to automation
The requirements for molds in the semiconductor packaging mold industry are as follows: First, the requirements for finishing molds, the current electronic products are continuously integrated and miniaturized, the products tend to be high-end, the size is getting smaller and smaller, and the package is getting thinner and thinner. The higher the quality, the higher the precision of the mold.
The plastic mold process is one of the most important process methods in the post-process production of semiconductor devices. It generally uses single-cylinder packaging technology, and its package includes DIP, SOP, QFP, SOT, SOD, TR discrete devices and chip tantalum capacitors and inductors. , bridge circuit and other products.
Packaging technology is constantly evolving. The chip size is reduced, the ratio of chip area to package area is closer to 1, the number of I/Os is increased, and the pitch of pins is reduced. The development of packaging technology is inseparable from advanced electronic tooling equipment, multi-injection mold packaging (MGP), automatic die-cutting system, automatic packaging system and other high-tech new products to meet this demand, Sanjia also launched these product.
Multi-injection head package (MGP) is an extension of single-cylinder mold technology and is the mainstream product of today's packaging molds. The utility model adopts a multi-barrel and multi-injection head package form, and has the advantages that the flow channel can be balanced, the close-in filling is realized, the resin utilization rate is high, the packaging process is stable, and the product packaging quality is good. It is suitable for SSOP, TSSOP, LQFP and other multi-row, small pitch, high-density integrated circuits and SOT, SOD and other micro-semiconductor device package.
The automatic die cutting system is an automated device for forming integrated circuits and semiconductor devices. High-speed, multi-functional, and versatile is the development direction of the system, which can meet the molding of various lead frame carriers.
In the future, the development direction of semiconductor packaging molds is to develop packaging molds with higher precision and higher speed - automatic packaging molds. The automatic plastic sealing system is a high-precision, high-automatic equipment for the post-process packaging of integrated circuits. A plurality of plastic sealing working units are arranged in the system, and a modular MGP mode is installed in each unit, and a plurality of units are packaged in the order of preparation, and the whole machine is assembled, loaded, packaged, unloaded, cleaned, glued, and collected. In one. The technology has developed rapidly in foreign countries, and technologies such as film covering and packaging, and plastic packaging have appeared, which can meet the packaging of various high-density and high-lead products.
With the rapid development of microelectronics technology, the application technology of semiconductor post-sealing molding equipment has been continuously improved, and automation has become an inevitable trend. As the first listed company in the mold industry in China, Sanjia will focus on the world's advanced technology and develop the localization process of electronic molds.
2, the connector has high requirements for the mold manufacturing industry
As a port for transmitting signals, the connector has been widely used in various industries such as mobile phones, computers, program-controlled switching, and home appliances. At present, foreign manufacturers occupy the high-end connector market, and domestic manufacturers are mainly low-end, which is partly affected by the level of the connector mold industry. Because the connector mold involves injection molding, terminal stamping, electroplating, etc., Guosheng mainly makes terminal stamping dies, including mobile phone SIM card terminal molds, computer CPU socket STOCK terminal molds, and electrical terminal molds.
In terms of connector terminal molds, domestic manufacturers are mainly low-end, while Guosheng is mainly oriented to high-end areas. Guosheng is currently supporting international connector manufacturers such as Amp AMP and Molex.
The connector has high requirements for the mold manufacturing industry: First, it requires a high level of mold design. Due to the different shapes of the terminals, the connectors have different structures. How to carry out reasonable design is very important. If the structure is unreasonable, the product will be unqualified. . The second is high-precision equipment. The connector terminals require high precision of processing equipment. The accuracy of foreign equipment can reach ±0.002mm, while the average domestic equipment can only reach ±0.01mm. The third is a good processing basic process. A good connector mold requires a perfect combination of design, equipment and process. At the same time, this equipment has higher requirements for matching and high technical barriers. Guosheng uses advanced CNC surface grinding, automatic optical curve grinding, slow wire cutting, machining center and other equipment combinations for production.
Future connector terminal mold requirements are getting higher and higher, which is due to the trend of connector interface miniaturization and high data transmission rate. Therefore, the requirements for mold equipment, materials, quality, etc. are higher, and the punching speed of the punch used in the mold has reached 500 rpm/3000 rpm, which puts higher requirements on the mold enterprises.
Luo Baihui pointed out that China's IT mold enterprises must continuously invest in equipment, and by investing in the most advanced equipment, they can introduce the highest level of technology and technology, and then carry out research and innovation. At present, the wire cutting and 4-axis processing equipment required for connector molds are already manufactured by domestic manufacturers. Although there are still gaps in accuracy and stability, this is a good start. In addition, the mold enterprises must carry out talent training, and constantly improve the technical level of the mold with the method of “going out, please come inâ€.
In addition, the development of small household appliances market, agricultural machinery, food machinery, construction hardware industry will also drive the rapid development of household air conditioning heat sink molds, motor molds, electron gun molds, sheet metal mold industry, and the world's advanced level.
3. Equipment and standardization development will be higher
Although China's mold industry has made great progress and made great progress, in the upstream and downstream supporting links of the mold industry, most of the processing equipment relies on imports, and the machine tool is a weak link. According to Luo Baihui, in 2004, the machine tools in imported processing equipment were about 6 billion US dollars, and most of them used in the mold industry, which also reflected that the domestic industry still needs to refuel in this field. Qin Hao, deputy secretary-general of China Die & Mould Industry Association, believes that domestic manufacturers should pay attention to the equipment manufacturing industry to pay attention to the needs of the mold industry. At present, domestic equipment manufacturers such as Shenyang Machine Tool Group Co., Ltd. have realized the “value-added†potential of mold machine tools, focusing on machining centers. Development and production of CNC machine tools and other equipment. The development of machine tools in the direction of high speed, precision, high performance specialization, systemization, and compounding has also brought new problems to domestic manufacturers.
In the field of mold standard parts, the standard parts of molds that have been produced in China are mainly mold bases, guides, punches, etc., and oil-containing guide plates and wedges for automobile molds. According to Luo Baihui, the coverage of China's mold standard parts in molds is only 40%, and in Europe and the United States, it has reached 70%. Luo Baihui pointed out that standardization has become a new trend in the development of the mold industry. The mold industry should expand the variety of mold standard parts, improve its precision, increase production concentration, and achieve large-scale production.
Stainless Steel Solid Door Lever Handles
The biggest advantage of stainless steel investment casting of Door Hardware is that investment casting can manufacture various types and shapes of door hardware. Secondly, investment casting is the most accurate casting method, helping to achieve good surface finish and dimensional accuracy.
Solid Stainless steel door handles offer style and durability, now a timeless classic used in homes and commercial buildings alike. The full-body structure and texture provides the most luxury touch.
Stainless Steel Handles For Door ,Door Lever, Lever Handles Set, Solid Door Lever Handles
Leader Hardware Manufacturer Limited , https://www.leaderhardwarecn.com