Method and circuit board for selective plating on circuit board surface

Application No.8

Application date: 2010.08.13

Name: Method and circuit board for selective plating on the surface of the board

Public (announcement) number: CN102373492A

Public (announcement) day: 2012.03.14

Main classification number: C25D5/02(2006.01)I

Application (patent): Peking Founder Group Co., Ltd.

Address: 9th Floor, Fangzheng Building, No. 298 Chengfu Road, Haidian District, Beijing

Zip code: 100871

Patent Agency: Beijing Tongda Xinheng Intellectual Property Agency Co., Ltd.

Agent: Guo Runxiang

Summary

The invention discloses a method and a circuit board for performing selective electroplating on a surface of a circuit board, comprising: covering a surface of the circuit board with a conductive layer; covering an unplated area on the surface of the conductive layer with an anti-plating protective layer; Electroplating of the electroplated protective layer covered by the electroplated protective layer to obtain a first surface treated electroplated metal layer; performing a non-first surface treatment, wherein on the surface formed by the last surface treatment, on the non-first surface The treated electroless plating region covers the anti-electroplating protective layer; and electroplating is performed on the electroplated region not covered by the anti-plating protective layer to obtain the non-first surface-treated electroplated metal layer; the anti-electroplating protective layer is removed, and the etching is not performed A conductive layer covered by a plated metal layer. The above method eliminates the need to arrange plating leads on the surface of the board, and avoids the influence of the plating leads on the wiring density.

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Tag: Electroplating Circuit Board Peking University Founder Group Co., Ltd. Metal Layer Application Date

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